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Silicone thermally conductive paste HSPA25I from NEDIS supporting heat dissipation with operating temperature from -50°C to 180°C and thermal conductivity coefficient 3.2 W/m.K.
The thermal paste supports the heat transfer between the electronic components and the radiator. It is necessary for the correct operation of each type of temperature sensors. It protects against atmospheric influences and prevents breakthroughs. The thermopath is characterized by very good chemical resistance to oxidation, sulfur dioxide, aqueous solutions of acids, alkalis, salts, and ammonia. When using SSR relays, semiconductor elements and other electronic components and instruments, it is usually necessary to use a heat-conducting paste. It is also used in computer technology, processors and video cards.