Silicone thermally conductive paste HSPA25I from NEDIS supporting heat dissipation with operating temperature from -50°C to 180°C and thermal conductivity coefficient 3.2 W/m.K.
The thermal paste supports the heat transfer between the electronic components and the radiator. It is necessary for the correct operation of each type of temperature sensors. It protects against atmospheric influences and prevents breakthroughs. The thermopath is characterized by very good chemical resistance to oxidation, sulfur dioxide, aqueous solutions of acids, alkalis, salts, and ammonia. When using SSR relays, semiconductor elements and other electronic components and instruments, it is usually necessary to use a heat-conducting paste. It is also used in computer technology, processors and video cards.
Specifications
Technical parameters of Silicone thermal paste HSPA25I, 25g
Brand:
NEDIS
Thermal paste type:
silicone
Тhermal conductance coefficient:
3.2 [W/m.K]
Packing:
syringe
Package:
25g
Operating temperature:
-50~180 [°C]
Files
Technical documentation of Silicone thermal paste HSPA25I, 25g