Silicone thermally conductive paste HSPA25I from NEDIS supporting heat dissipation with operating temperature from -50°C to 180°C and thermal conductivity coefficient 3.2 W/m.K.
Quantity | 1+ | 3+ | 5+ | 10+ | 25+ |
Price | BGN 10.06 | BGN 9.06 | BGN 8.55 | BGN 8.05 | BGN 7.55 |
List Price |