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Silicone thermal paste HSPA25I, 25g

Name: Silicone thermal paste HSPA25I, 25g
Brand: NEDIS
SKU: 109357
Price: 12.90 BGN
Availability: InStock

Silicone thermally conductive paste HSPA25I from NEDIS supporting heat dissipation with operating temperature from -50°C to 180°C and thermal conductivity coefficient 3.2 W/m.K.

Manufacturer:

NEDIS

Weight:

0.040 Kgs

Availability

Qty

Delivery time

In Stock

48 h

Vikiwat Store

shop purchase

In stock

BGN 12.90 VAT Incl.

Prices for quantities (VAT Incl.)

Quantity	1+	3+	5+	10+	25+
List Price	BGN 12.90	BGN 11.61	BGN 10.97	BGN 10.32	BGN 9.68

SKU: 109357

Description Specifications Files Reviews

Description

Application

The thermal paste supports the heat transfer between the electronic components and the radiator. It is necessary for the correct operation of each type of temperature sensors. It protects against atmospheric influences and prevents breakthroughs. The thermopath is characterized by very good chemical resistance to oxidation, sulfur dioxide, aqueous solutions of acids, alkalis, salts, and ammonia. When using SSR relays, semiconductor elements and other electronic components and instruments, it is usually necessary to use a heat-conducting paste. It is also used in computer technology, processors and video cards.

Specifications

Technical parameters of Silicone thermal paste HSPA25I, 25g

Brand:

NEDIS

Thermal paste type:

silicone

Тhermal conductance coefficient:

3.2 [W/m.K]

Packing:

syringe

Package:

25g

Operating temperature:

-50~180 [°C]

Files

Technical documentation of Silicone thermal paste HSPA25I, 25g

Datasheet NEDIS HSPA25I (EN) PDF, 1.42 MB

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