Silicone thermally conductive paste HSPA25I from NEDIS supporting heat dissipation with operating temperature from -50°C to 180°C and thermal conductivity coefficient 3.2 W/m.K.
Quantity | 1+ | 3+ | 5+ | 10+ | 25+ |
Price | BGN 9.80 | BGN 8.82 | BGN 8.33 | BGN 7.84 | BGN 7.35 |
List Price |